MRF6S19140HR3 MRF6S19140HSR3
9
RF Device Data
Freescale Semiconductor
PACKAGE DIMENSIONS
CASE 465B-03
ISSUE D
NI-880
MRF6S19140HR3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M?1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION H IS MEASURED 0.030 (0.762) AWAY
FROM PACKAGE BODY.
4. RECOMMENDED BOLT CENTER DIMENSION OF
1.16 (29.57) BASED ON M3 SCREW.
DIM MIN MAX MIN MAX
MILLIMETERS
INCHES
A
1.335 1.345 33.91 34.16
B
0.535 0.545 13.6 13.8
C
0.147 0.200 3.73 5.08
D
0.495 0.505 12.57 12.83
E
0.035 0.045 0.89 1.14
F
0.003 0.006 0.08 0.15
G
1.100 BSC 27.94 BSC
H
0.057 0.067 1.45 1.70
K
0.175 0.205 4.44 5.21
N
0.871 0.889 19.30 22.60
Q
.118 .138 3.00 3.51
R
0.515 0.525 13.10 13.30
STYLE 1:
PIN 1. DRAIN
2. GATE
3. SOURCE
1
3
2
D
G
K
C
E
H
F
Q
2X
bbb BT
A
M
M
M
bbb BT
A
M
M
M
B
B
(FLANGE)
T
SEATING
PLANE
ccc BT
A
M
M
M
bbb BT
A
M
M
M
AA
(FLANGE)
N
(LID)
M
(INSULATOR)
S
(INSULATOR)
aaa BT
A
M
M
M
R
(LID)
ccc BT
A
M
M
M
S
0.515 0.525 13.10 13.30
M
0.872 0.888 22.15 22.55
aaa
0.007 REF 0.178 REF
bbb
0.010 REF 0.254 REF
ccc
0.015 REF 0.381 REF
4
CASE 465C-02
ISSUE D
NI-880S
MRF6S19140HSR3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M?1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION H IS MEASURED 0.030 (0.762) AWAY
FROM PACKAGE BODY.
DIM MIN MAX MIN MAX
MILLIMETERS
INCHES
A
0.905 0.915 22.99 23.24
B
0.535 0.545 13.60 13.80
C
0.147 0.200 3.73 5.08
D
0.495 0.505 12.57 12.83
E
0.035 0.045 0.89 1.14
F
0.003 0.006 0.08 0.15
H
0.057 0.067 1.45 1.70
K
0.170 0.210 4.32 5.33
N
0.871 0.889 19.30 22.60
R
0.515 0.525 13.10 13.30
STYLE 1:
PIN 1. DRAIN
2. GATE
3. SOURCE
1
T
SEATINGPLANE
AA
2
D
K
C
E
H
F
bbb BT
A
M
M
M
B
B
(FLANGE)
ccc BT
A
M
M
M
bbb BT
A
M
M
M
(FLANGE)
N
(LID)
M
(INSULATOR)
ccc BT
A
M
M
M
aaa BT
A
M
M
M
R
(LID)
S
(INSULATOR)
S
0.515 0.525 13.10 13.30
M
0.872 0.888 22.15 22.55
bbb
0.010 REF 0.254 REF
ccc
0.015 REF 0.381 REF
aaa
0.007 REF 0.178 REF
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